MECHANIC Heat Kit Reflow Soldering Heating PlatformMECHANIC Heat Kit Reflow Soldering Heating Platform 3. 4 inch color large screen display, clear at a glance Turbo fan cooling, built in strong wind cooling system Time temperature curve, real time observation of temperature Double ceramic heating element, heating up faster and stable performance Phone Repair iPhone X 14PM Model, Motherboard Repair Heating Platform Reflow Soldering heating platform MECHANIC Heat Kit For IP X XS 11 12 13 Mini Pro MAX

Temperature range 100~500℃

Box dimension

- BGA Reballing Fixture

ensure high thermal conductivity and heat up speed

the best choice for Chip IC NAND motherboard grinding

Strong suction

Uncompromising performance in an ultra light body

unbind accessories

-14 14Plus 14Pro 14Promax

real-time monitoring temperature

more efficient

Mechanical ammeter interface design